Structural bonding and debonding system

Details Structural bonding and debonding system Structural bonding and debonding system

1991-01-28

1992-03-31

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

1563042, 156584, 294264, 219535, 219544, 285 41, B32B 706, B32B 108

Patent

active

051004941

ABSTRACT:
Two pieces (12 and 14) of material are releasably bonded together with a thermoplastic adhesive (28) in which a heating element (30) is embedded. After application, the adhesive (28) cures at ambient temperature or at a low elevated temperature produced by passing an electrical current through the heating element (30), to bond the pieces (12 and 14) together. The pieces (12 and 14) are debonded or separated by passing a relatively high electrical power through the heating element (30), to soften or melt the adhesive (28). A preferred adhesive (28) is a cyanoacrylate.

REFERENCES:
patent: 3378672 (1966-03-01), Blumenkranz
patent: 3527663 (1970-09-01), Rose et al.
patent: 3542619 (1970-11-01), McManus
patent: 3573149 (1971-03-01), Tibble et al.
patent: 3574024 (1971-04-01), Rose
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 4131980 (1979-01-01), Zinnbauer
patent: 4184000 (1980-01-01), Denman
patent: 4555607 (1985-11-01), Roentgen et al.
patent: 4698409 (1987-10-01), Goel
patent: 4803021 (1989-02-01), Werth et al.

Affiliated with

Also associated with

Rating

Structural bonding and debonding system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Structural bonding and debonding system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structural bonding and debonding system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2256495