Structural analysis of a printed wiring substrate

Details Structural analysis of a printed wiring substrate Structural analysis of a printed wiring substrate

2011-08-09

2011-08-09

Rodriguez, Paul L (Department: 2123)

Data processing: structural design, modeling, simulation, and em

Simulating nonelectrical device or system

C703S002000, C703S005000, C065S377000, C065S484000

Reexamination Certificate

active

07996196

ABSTRACT:
A first generation portion divides an object to be analyzed into a plurality of finite elements to generate element division data. A first calculation portion defines and calculates a plurality of meshes dividing the object to be analyzed into units larger than the finite elements. A second generation portion assumes that a friction layer which has a thickness of “0” and a friction coefficient between a conductive material and a composite material of a predetermined value less than 1 exists at the interface between the conductive material and the composite material, and the second generation portion generates mesh data. A second calculation portion uses various solvers to calculate the physical amounts produced in the object to be analyzed on the basis of the mesh data and outputs the analysis result. In other words, the second calculation portion performs a simulation of the behavior of the object to be analyzed.

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