Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2007-06-12
2007-06-12
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S081000, C257S082000, C257S083000, C257S107000, C257S582000, C257S586000, C257S585000, C257S666000, C257S678000
Reexamination Certificate
active
11070199
ABSTRACT:
As external connection terminals for an emitter electrode (12) of an IGBT chip, a first emitter terminal (151) for electrically connecting a light emitter in a strobe light control circuit to the emitter electrode (12) and a second emitter terminal (152) for connecting a drive circuit for driving an IGBT device to the emitter electrode (12) are provided. The first emitter terminal (151) and the second emitter terminal (152) are individually connected to the emitter terminal (12) by wire bonding.
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Erdem Fazli
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Pert Evan
Renesas Technology Corp.
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