Stripping method for removing resist from a printed circuit boar

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427 541, 427271, 430329, 430313, C23C 2600

Patent

active

051457172

ABSTRACT:
A stripping method is provided to remove processed photoresist images from printed circuit substrates without damage to underlying high density circuitry. A solid particulate blast process is used to remove the resist images wherein the polymeric particles having a Mho hardness in the range from 2.0 to 4.0 are used as the blast media.

REFERENCES:
patent: 3930857 (1976-01-01), Bendz
patent: 4302530 (1981-11-01), Zemel
patent: 4458617 (1985-10-01), Miyatani et al.
patent: 4698294 (1987-10-01), Lau
patent: 4711835 (1987-12-01), Dufour
patent: 4731125 (1988-03-01), Carr
patent: 4759774 (1988-07-01), Hochberg et al.
patent: 4912020 (1990-03-01), King
patent: 4983252 (1991-01-01), Masui

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Stripping method for removing resist from a printed circuit boar does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stripping method for removing resist from a printed circuit boar, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stripping method for removing resist from a printed circuit boar will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-133251

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.