Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1985-05-17
1986-07-22
Godici, Nicholas P.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
427 96, B23K 3102
Patent
active
046014241
ABSTRACT:
A method for fabricating metallurgical contacts is disclosed for making thermocompression bonds to a metallized ceramic substrate on which semiconductor chips are to be mounted and electrically contacted. The method comprises placing a nickel layer on the metallized portion of the substrate and then covering the nickel with an immersion layer of gold. The gold immersion layer is selectively removed from locations where thermocompression-bonded contacts are desired. Removal is accomplished by applying a chemical stripper. Heavy gold is electroplated on said locations and the assemblage is heat treated prior to placement of the thermocompression-bonded contacts.
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IBM Technical Disclosure Bulletin, vol. 20, No. 9, Feb. 1978, pp. 3443-3444, "Selectively Electroplating Pad Terminals on an MLC Substrate" by M. M. Haddad.
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IBM Technical Disclosure Bulletin, vol. 19, No. 12, May 1977, p. 4581, "Process for Preventing Chip Pad Corrosion" by M. M. Haddad et al.
Adwalpalker Avinash S.
Harvilchuck Joseph M.
Ranalli Joseph R.
Rich David W.
Godici Nicholas P.
Haase Robert J.
International Business Machines - Corporation
Reid G. M.
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