Strippable solder mask material comprising polysulfone, silicon

Chemistry of carbon compounds – Miscellaneous organic carbon compounds

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148 22, 228118, 228180R, 228215, 260 37R, 427 58, 427259, 428411, B23K 3522, C08G 7520

Patent

active

041208439

ABSTRACT:
A polysulfone base stop resist material to protect gold thermocompression bonding sites on a circuit module during a solder dipping operation. Along with the thermoplastic, thermostable strippable base of polysulfone, the resist includes a solvent for the polysulfone and a filler which holds the melted polysulfone in place during the solder dipping operation.

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