Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1979-04-13
1981-03-03
Smith, John D.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
1014011, 106 32, 156668, 156901, 156904, 1566591, 228118, 228180R, 427 98, 427195, 427202, 427259, C23F 102
Patent
active
042541638
ABSTRACT:
A printed circuit board is formed from a metal-clad substrate by applying a solvent-free, non-dryable ink in a predetermined pattern on the substrate, dusting powdered resin over the surface, removing any resin powder not retained by the ink from the surface, heating the substrate having the ink powder thereon to a temperature so as to fuse the powdered resin to form a strippable resist, etching the uncoated portion of the metal laminate and stripping the resist subsequent to etching.
REFERENCES:
patent: 2110219 (1938-03-01), Green et al.
patent: 3640219 (1972-02-01), Farnham et al.
patent: 3854973 (1974-12-01), Meesereau
patent: 3911160 (1975-10-01), Neuberg
patent: 4073981 (1978-02-01), Baron
patent: 4145460 (1979-03-01), Finley et al.
patent: 4157936 (1979-06-01), Piazza
Hercules Incorporated Product Data Sheet No. 7167-3.
Hercules Incorporated Product Data Sheet No. 7166-2.
"Piccolastic" published by Pennsylvania Industrial Chem. Corp.
Smith John D.
Spivak J. F.
Western Electric Company Inc.
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