Radiation imagery chemistry: process – composition – or product th – Stripping process or element
Patent
1998-11-20
2000-10-10
Schilling, Richard L.
Radiation imagery chemistry: process, composition, or product th
Stripping process or element
430 97, 430124, 430207, 430259, 430262, 430263, 430201, 430212, 430432, 430512, 430523, 430536, 430961, 347106, 503227, G03C 1805, G03C 852, G03C 1112
Patent
active
061300241
ABSTRACT:
The invention relates to an imaging element comprising support having adhered to the backside a strippable polymer layer that when removed has an adhesive layer thereon.
REFERENCES:
patent: 2391171 (1945-12-01), Lane
patent: 3149973 (1964-09-01), Winchell
patent: 3168402 (1965-02-01), Branibar
patent: 3183092 (1965-05-01), Mackey et al.
patent: 3359107 (1967-12-01), Goffe et al.
patent: 4409316 (1983-10-01), Zeller-Pendley et al.
patent: 4778782 (1988-10-01), Ito et al.
patent: 4971950 (1990-11-01), Kato et al.
patent: 5397634 (1995-01-01), Kuroda et al.
patent: 5466519 (1995-11-01), Shirakura et al.
patent: 5514460 (1996-05-01), Surman et al.
patent: 5853965 (1998-12-01), Haydock et al.
patent: 5866282 (1999-02-01), Bourdelais et al.
patent: 5874205 (1999-02-01), Bourdelais et al.
patent: 5955239 (1999-09-01), Haydock et al.
Patent Abstracts of Japan, Publication No. 01078251, Mar. 1989.
Patent Abstracts of Japan, Publication No. 01191139, Aug. 1989.
Patent Abstracts of Japan, Publication No. 05249615, Sep. 1993.
Aylward Peter T.
Bourdelais Robert P.
Cournoyer Robert F.
Gula Thaddeus S.
Eastman Kodak Company
Leipold Paul A.
Schilling Richard L.
LandOfFree
Strippable repositionable back sheet for photographic element does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Strippable repositionable back sheet for photographic element, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Strippable repositionable back sheet for photographic element will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2255068