Striping process for stripping compounds of titanium from base m

Details Striping process for stripping compounds of titanium from base m Striping process for stripping compounds of titanium from base m

1992-12-28

1994-03-01

Breneman, R. Bruce

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 3, 134 41, 252102, 252136, C11D 708, C23G 102, C23G 114

Patent

active

052903621

ABSTRACT:
An aqueous stripping solution and method for selectively removing a titanium compound from a base metal. The aqueous solution contains a source of hydrogen peroxide, an alkali source of hydroxyl ions and an acid with the components in a concentration such that the pH of the solution is above 8.

REFERENCES:
patent: 2649361 (1953-08-01), Springer et al.
patent: 3300349 (1967-01-01), Tershin et al.
patent: 3356500 (1964-09-01), Autrey
patent: 3649194 (1972-03-01), Glanville
patent: 3903244 (1975-09-01), Winkley
patent: 4022703 (1977-05-01), Bakes et al.
patent: 4410396 (1983-10-01), Somers et al.
patent: 4459216 (1984-07-01), Nakazato et al.
patent: 4545918 (1985-10-01), Pralus
patent: 4554049 (1985-11-01), Bastenbeck
patent: 4600443 (1986-07-01), Basalyk et al.
patent: 4608091 (1986-08-01), Sullivan
patent: 4619707 (1986-10-01), Mirschmeier et al.
patent: 4707191 (1987-11-01), Martinou et al.
patent: 4746369 (1988-05-01), Sullivan et al.
patent: 4770808 (1988-09-01), McDonogh et al.
patent: 4950359 (1990-08-01), Parissis et al.
patent: 4970094 (1990-11-01), Byrd

Affiliated with

Also associated with

Rating

Striping process for stripping compounds of titanium from base m does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Striping process for stripping compounds of titanium from base m, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Striping process for stripping compounds of titanium from base m will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-573676