Stress testing equipment with an integral cooling plenum

Details Stress testing equipment with an integral cooling plenum Stress testing equipment with an integral cooling plenum

1988-10-27

1992-04-07

Eisenzopf, Reinhard J.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

324 731, G01R 1512

Patent

active

051031680

ABSTRACT:
To prevent degradation of the connectors which connect a driver board to a carrier board, the present invention stress testing equipment positions its connectors at the rear of a moderate temperature section, away from a high temperature oven chamber of the testing equipment. By sealing the interface barrier between the high temperature chamber and the moderate temperature section and by circulating cool air through the moderate temperature section, a temperature gradient is effected along the length of the portion of the carrier board that is located within the moderate temperature section. Accordingly, the connectors located at the interface between the moderate temperature section and the ambient temperature section no longer are exposed to a high temperature environment, thereby no longer succumbing to material fatigue or degradation, albeit the electronic components carried on the portion of the carrier card that is exposed to the high temperature environment in the oven chamber continue to be stress tested in the high temperature environment.

REFERENCES:
patent: 4145620 (1979-03-01), Dice
patent: 4468616 (1984-08-01), Yoshizaki
Bruder et al., "Carrier Card Assembly for Component Aging"-IBM Technbical Disclosure Bulletin, vol. 14, No. 3, Aug. 1971, p. 737.
Belyeu et al., "Dynamic Burn-In System", IBM Technical Disclosure Bulletin, vol. 22, No. 8A, Jan. 1980, pp. 3065-3068.

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