Stress sensor and electronic device with same

Measuring and testing – Specimen stress or strain – or testing by stress or strain... – Specified electrical sensor or system

Reexamination Certificate

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C073S862627

Reexamination Certificate

active

07918140

ABSTRACT:
The present invention relates to a stress sensor to be combined with an assembled object of an input unit of an electronic device. The stress sensor includes a circuit substrate and a pointing operation element disposed on a surface of the circuit substrate. The circuit substrate is combined with an assembled object of an input unit by a connecting mechanism such that the circuit substrate is directly attached onto a surface of the assembled object. As a result, the overall height of the stress sensor and the assembled object is reduced in comparison with the prior art.

REFERENCES:
patent: 5489900 (1996-02-01), Cali et al.
patent: 5499041 (1996-03-01), Brandenburg et al.
patent: 5640178 (1997-06-01), Endo et al.
patent: 6040823 (2000-03-01), Seffernick et al.
patent: 6359613 (2002-03-01), Poole
patent: 7040182 (2006-05-01), Teraoka
patent: 7148880 (2006-12-01), Magara
patent: 7176891 (2007-02-01), Inukai
patent: 2004/0130529 (2004-07-01), Magara
patent: 2005/0039549 (2005-02-01), Teraoka

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