Stress relieved intermediate insulating layer for multilayer met

Details Stress relieved intermediate insulating layer for multilayer met Stress relieved intermediate insulating layer for multilayer met

1985-06-21

1987-03-31

Morgenstern, Norman

Stock material or miscellaneous articles

Composite

Of quartz or glass

427 34, 427 96, 427 99, 427226, 427240, 427255, 427269, 427271, 427379, 427380, 427404, 4274192, 4274193, 4274194, 4274196, 428432, 428901, B65D 512, B32D 1706

Patent

active

046542698

ABSTRACT:
There is disclosed herein a stress relieved intermediate insulating layer consisting of one or more layers of spun-on glass lying over a metalization pattern. The spun-on layers are allowed to crack from thermal stress imposed upon the structure. The cracks in the spun-on layers are then filled with a glass layer deposited by CVD or LPCVD.

REFERENCES:
patent: 3475210 (1969-10-01), Lehrer
patent: 4045594 (1977-08-01), Maddocks
patent: 4417914 (1983-11-01), Lehrer
patent: 4468437 (1984-08-01), Patten et al.
patent: 4492717 (1985-01-01), Pliskin et al.
patent: 4508757 (1985-04-01), Fabricius
VLSI Technology, edited by S. M. Sze, ISBN 0-07-062686-3 (1983) pp. 107, 109, 111-115.

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