Stress relieved hose routing to liquid-cooled electronics...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S679470, C361S679530, C361S698000, C361S699000, C312S223100, C312S236000, C165S104330, C138S110000

Reexamination Certificate

active

08077462

ABSTRACT:
A cooling apparatus and method are provided which include an air-to-liquid heat exchanger and system coolant inlet and outlet plenums mounted to an electronics rack door along an edge of the door remote from the edge hingedly mounted to the rack. The plenums are in fluid communication with the heat exchanger and respectively include an inlet and outlet. Coolant supply and return hoses are disposed above the electronics rack and couple the inlet plenum to a coolant supply header and the outlet plenum to a coolant return header. The hoses are sufficiently long and flexible to open or close the door. A stress relief structure is attached to the top of the door and clamps the supply and return hoses in fixed relation to relieve stress on connect couplings at the ends of the hoses to the plenum inlet and outlet during opening or closing of the door.

REFERENCES:
patent: 3853148 (1974-12-01), De Vincent et al.
patent: 4011905 (1977-03-01), Millard
patent: 4775286 (1988-10-01), Gillette et al.
patent: 4893670 (1990-01-01), Joshi et al.
patent: 5467250 (1995-11-01), Howard et al.
patent: 5782546 (1998-07-01), Iwatare
patent: 6164369 (2000-12-01), Stoller
patent: 6462944 (2002-10-01), Lin
patent: 6535382 (2003-03-01), Bishop et al.
patent: 6760221 (2004-07-01), Goth et al.
patent: 6775137 (2004-08-01), Chu et al.
patent: 7086247 (2006-08-01), Campbell et al.
patent: 7679909 (2010-03-01), Spearing et al.
patent: 2004/0177948 (2004-09-01), Cho et al.
patent: 2005/0231913 (2005-10-01), Malone et al.
patent: 2006/0232945 (2006-10-01), Chu et al.
patent: 2009/0080173 (2009-03-01), Porter et al.
patent: 2009/0122488 (2009-05-01), Iyengar et al.
patent: 2009/0154159 (2009-06-01), Graybill et al.
patent: 2009/0225514 (2009-09-01), Correa et al.
“RackCooler”—A Cool Solution for X-Treme Density Rack Enclosure Systems, Liebert Corporation, Product Brochure, 8 pgs. (2001).
Teague, Paul E., “One Cool Machine”, Design News for Mechanical and Design Engineers, Internet Article, 6 pgs. (Feb. 7, 2005).

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