Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-07-22
2008-07-22
Thai, Luan (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S124000, C438S027000, C257SE23118, C257SE23124
Reexamination Certificate
active
07402458
ABSTRACT:
An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic base and from the window piece. The window frame may be comprised of a single piece of sheet metal that has been stamped to include a stress-relieving contour. The stress-relieving contour may be comprised of a variety of shapes, including a “U” shape, an inverted “U” shape, a curved step shape, or other combinations thereof.
REFERENCES:
patent: 5508740 (1996-04-01), Miyaguchi et al.
patent: 5936758 (1999-08-01), Fisher et al.
patent: 6028351 (2000-02-01), Klonis et al.
patent: 6323982 (2001-11-01), Hornbeck
patent: 6627814 (2003-09-01), Stark
patent: 6639313 (2003-10-01), Martin et al.
patent: 6661668 (2003-12-01), Weiblen
patent: 55-166939 (1980-12-01), None
patent: 355157243 (1980-12-01), None
patent: 356008853 (1981-01-01), None
patent: 56-56656 (1981-05-01), None
patent: 361012048 (1986-01-01), None
Armstrong Frank O.
Estabrook Daniel C.
Faris Jeffrey E.
Fisher Edward Carl
Haskett Bradley Morgan
Brady III W. James
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Thai Luan
LandOfFree
Stress relieved flat frame for DMD window does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stress relieved flat frame for DMD window, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stress relieved flat frame for DMD window will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2784033