Stress relief substrate for solder ball grid array mounted circu

Details Stress relief substrate for solder ball grid array mounted circu Stress relief substrate for solder ball grid array mounted circu

1997-12-08

2000-12-19

Gaffin, Jeffrey

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361760, 361777, 361779, 361790, 361784, 174250, 174255, 174260, 174262, 228179, 2281801, 2281802, H05K 111

Patent

active

06163462&

ABSTRACT:
A stress relief substrate having a pair of ball grid arrays (BGAs) is interposed between a PC board and an electrical component. The BGAs are electrically connected through vias in the stress relief substrate to connect component circuitry to the PC board. In one embodiment, the BGAs are offset on a flexible substrate so that there is some open space between the edges of electrically connected solder balls. This allows the substrate to warp during thermal cycling and absorb the stress caused by TCE mismatch. In another embodiment, the BGAs are aligned on a rigid substrate that is formed with holes interposed between the solder balls. This reduces the amount of material that interconnects the solder balls so that the substrate tends to flex rather than transfer the TCE stress to the solder balls.

REFERENCES:
patent: 5477933 (1995-12-01), Nguyen
patent: 5499444 (1996-03-01), Doane, Jr. et al.
patent: 5598036 (1997-01-01), Ho
patent: 5620927 (1997-04-01), Lee
patent: 5652185 (1997-07-01), Lee
patent: 5663594 (1997-09-01), Kimura
patent: 5874776 (1999-02-01), Kresge et al.

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