Stress relief of a semiconductor device

Details Stress relief of a semiconductor device Stress relief of a semiconductor device

2011-06-14

2011-06-14

Loke, Steven (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

With peripheral feature due to separation of smaller...

C438S462000

Reexamination Certificate

active

07960814

ABSTRACT:
A semiconductor device includes a die including an active region, a scribe region, and a perimeter, wherein the scribe region is closer to the perimeter than the active region. In one embodiment, the die further comprises a crack arrest structure formed in the scribe region, and wherein the crack arrest structure includes one of curva-linear shapes and polygonal shapes concentrically oriented around a common center located at or near at least one corner of the die.

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