Stress relief for electroplated films

Details Stress relief for electroplated films Stress relief for electroplated films

2004-05-28

2008-12-02

Hendricks, Keith D. (Department: 1794)

Stock material or miscellaneous articles

Structurally defined web or sheet

Nonplanar uniform thickness material

C428S192000, C428S212000, C428S220000, C205S112000, C205S118000, C205S238000, C205S255000

Reexamination Certificate

active

07459198

ABSTRACT:
An electroplated film is deposited over a substrate with a plating frame pattern that includes a plating field defined by a plurality of individual features. By dividing the plating field into a plurality of individual features, the delamination force at any location on the plating field is greatly reduced. Thus, a film with a large stress, such as a high moment film, may be plated to a greater thickness than is possible with conventionally plated films.

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