Static molds – Including means to apply force to remove or release product...
Reexamination Certificate
2007-01-09
2007-01-09
Heckenberg, Donald (Department: 1722)
Static molds
Including means to apply force to remove or release product...
C249S134000, C425S440000, C510S120000, C510S140000
Reexamination Certificate
active
11172532
ABSTRACT:
A stress-release mold is described for casting thermosetting compositions especially compositions designed for consumer use. At least one wall of the mold includes a stress-releasing-element characterized by having a more flexible region or regions than the remaining wall or walls of the mold and wherein the stress-releasing-element includes a region of lower curvature at least partially surrounded by a region of higher curvature. The stress-release mold greatly reduces or eliminates surface defects caused by shrinkage of thermosetting compositions as they cools. A system is also described that includes the inventive mold containing a thermosetting composition wherein the mold also serves as all or part of the package for the composition.
REFERENCES:
patent: 3149188 (1964-09-01), Schmitt et al.
patent: 4364878 (1982-12-01), Laliberte et al.
patent: 5255729 (1993-10-01), Cook
patent: 5615731 (1997-04-01), Roehrig et al.
patent: 5669208 (1997-09-01), Tabaroni et al.
patent: 5882557 (1999-03-01), Kazuhiro et al.
patent: 6793193 (2004-09-01), de Groote
patent: 2005/0014665 (2005-01-01), Nadakatti et al.
patent: 0 273 769 (1988-07-01), None
patent: 0 321 179 (1989-06-01), None
patent: 0 854 092 (1998-07-01), None
patent: 910 256 (1944-11-01), None
patent: 08-099163 (1994-04-01), None
patent: 10-323340 (1997-12-01), None
patent: 10-291230 (1998-11-01), None
patent: 94/08852 (1994-04-01), None
patent: 98/51773 (1998-11-01), None
Patent Abstracts of Japan—abstract of JP 10-291230—dated Feb. 8, 2005—1 page.
Patent Abstracts of Japan—abstract of JP 10-323340—dated Feb. 8, 2005—1 page.
Patent Abstracts of Japan—abstract of JP 08-099163—dated Feb. 8, 2005—1 page.
Abbas Syed Husain
Lang David John
Aronson Michael P.
Conopco Inc.
Heckenberg Donald
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