Stress release metallization for VLSI circuits

Details Stress release metallization for VLSI circuits Stress release metallization for VLSI circuits

1993-01-08

1994-10-25

Beck, Shrive

Coating processes

Electrical product produced

427 96, 427 99, 29840, 437 51, C23C 1400, C23C 1600

Patent

active

053587332

ABSTRACT:
A new metallization method for metal lines formation of a very large scale integrated circuit (VLSI) is described. The metal lines are formed in a "wavy" or "snaky" pattern. It is a "wavy" pattern when the metal line goes through a vertically vibratory path. It is a "snaky" pattern when a metal line goes through a horizontally vibratory path. This includes both uniform and random "wavy" and "snaky" patterns. A metal line can also be formed in a pattern that is both "wavy" and "snaky." For the "wavy" pattern, the topography under the metal lines is fabricated using, for example, field oxide. The "wavelength" can vary from 1 to 10 micrometers. A slight modification of the metal mask can produce the "snaky" structure of the metal line. The stresses will be released by a small curvature change of the metal line. For the contact structures, a multi-contact layout with "wavy" structure can release more stress than can a single-contact layout of the same contact area.

REFERENCES:
patent: 3247927 (1966-04-01), Cragg
patent: 4031272 (1977-06-01), Khanna
patent: 5162240 (1992-11-01), Saitou

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