Stress release feature for PWBs

Details Stress release feature for PWBs Stress release feature for PWBs

2005-07-26

2005-07-26

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C174S261000, C174S262000

Reexamination Certificate

active

06921867

ABSTRACT:
An element, such as a PWB or PCB is provided with elongated lower-stiffness areas, which provide the element with areas of a lower deformation during deformation of the element, such as during a fall thereof. Fragile or large electronic or electrical parts, such Integrated Circuits, such as BGAs are positioned at the lower deformation areas in order to maintain electrical connection to the element during and after the deformation of the element.

REFERENCES:
patent: 5121297 (1992-06-01), Haas
patent: 5717556 (1998-02-01), Yanagida
patent: 5923750 (1999-07-01), Enting et al.
patent: 6160713 (2000-12-01), Floyd et al.
patent: 6256877 (2001-07-01), Hacke et al.
patent: 6370038 (2002-04-01), Miyake et al.
patent: 6633078 (2003-10-01), Hamaguchi et al.
patent: 6754507 (2004-06-01), Takagi

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