Stress-enhanced performance of a FinFet using...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – With current flow along specified crystal axis

Reexamination Certificate

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C257S213000, C257SE21410, C257SE29262, C438S150000

Reexamination Certificate

active

07939862

ABSTRACT:
Different approaches for FinFET performance enhancement based on surface/channel direction and type of strained capping layer are provided. In one relatively simple and inexpensive approach providing a performance boost, a single surface/channel direction orientation and a single strained capping layer can be used for both n-channel FinFETs (nFinFETs) and p-channel FinFETs (pFinFETs). In another approach including more process steps (thereby increasing manufacturing cost) but providing a significantly higher performance boost, different surface/channel direction orientations and different strained capping layers can be used for nFinFETs and pFinFETs.

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