Measuring and testing – Specimen stress or strain – or testing by stress or strain... – Specified electrical sensor or system
Patent
1995-09-07
1998-03-03
Dombroske, George M.
Measuring and testing
Specimen stress or strain, or testing by stress or strain...
Specified electrical sensor or system
73819, 73146, G01B 716
Patent
active
057237921
ABSTRACT:
The invention is intended to provide a stress measuring device for a structure, wherein a plurality of stress sensors are composited or integrated to provide an integrated single-packaged stress composite sensor, the latter being used to deliver X-axis, X- and Z-axis or X-, Y- and Z-axis direction stress signals produced in the structure or deliver stress signals in selected directions, so as to make it possible to measure stresses.
A hole is formed in the stress concentration region of a structure whose stresses are to be measured, and a 1-direction stress composite sensor adapted to deliver stress signals in one direction alone, a 2-direction stress composite sensor adapted to deliver in two directions, or a 3-direction stress composite sensor adapted to deliver stress signals in three directions is selectively installed in the hole, whereby X-axis, X- and Z-axis or X-, Y- and Z-axis direction shearing strains produced in the structure or stresses corresponding to the selected stress composite sensor can be selectively measured.
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Automatik, vol. 14, No. 1, Jan. 1969 Bad Worishofen DE, pp. 10-17, "Die Auswahl geeigneter Dehnungsmessstreifen" (DMS) by K. Hoffman.
Electronics & Communications in Japan, Part II--Electronics, vol. 73, No. 11, Nov. 1990, New York, US, pp. 97-104, "Fabrication of Semiconductor Tactile Imager" by M. Esashi et al.
Dombroske George M.
Japan Electronics Industry Limited
Noori Max H.
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