Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-02-28
2006-02-28
Geyer, Scott (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S127000
Reexamination Certificate
active
07005321
ABSTRACT:
A stress-compensation layer is formed by pressing a solder bump into a compressible film within a mold chase. The stress-compensation layer flows against the solder bump and the compressible film such that at least a portion of the solder ball is embedded in the stress-compensation layer. The compressible film is removed to reveal at least a portion of the solder bump exposed and free of the stress-compensation layer. An article that exhibits a stress-compensation layer with a surface characteristic of the imposed flexible film is also included. A computing system that includes a stress-compensation layer with a surface characteristic of the imposed flexible film is also included.
REFERENCES:
patent: 6429043 (2002-08-01), Nakazawa et al.
patent: 6518093 (2003-02-01), Nakamikawa
patent: 6716665 (2004-04-01), Baba et al.
patent: 6897096 (2005-05-01), Cobbley et al.
Geyer Scott
Intel Corporation
Schwegman Lundberg Woessner & Kluth P.A.
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