Data processing: measuring – calibrating – or testing – Measurement system in a specific environment – Mechanical measurement system
Patent
1997-06-03
2000-08-08
Trammell, James P.
Data processing: measuring, calibrating, or testing
Measurement system in a specific environment
Mechanical measurement system
702 11, 356 355, 356 32, G01L 124, G01B 1116
Patent
active
061014508
ABSTRACT:
Stress, strain and displacement in two-dimensional regions can be calculated by computerized techniques. In the x-y plane, a region is discretized into four-node finite elements such as quadrilaterals and triangles with side nodes. Each such element has eight distinct deformation modes. These correspond to three rigid-body displacements, three uniform strain profiles for compressible materials or two deviatoric strain fields accompanied by an isotropic pressure for incompressible materials, and two flexures. Pointwise equilibrium requires the bending shapes to be functions of Poisson's ratio. Nodal equilibrium and compatibility are satisfied for prescribed loads implementing exact differentiation and integration. Element volume change parameters for compressible materials or isotropic pressure for incompressible materials are eliminated, and a linear system of equations is formed in terms of the seven remaining unknowns per element employing a neural-network solution strategy to pass simultaneously the patch and zero-locking tests. The strain and stress distributions including isotropic pressure for incompressible materials, and displacement profiles are solved as x-y polynomials. This technique, Tessellica, can be used in computer-aided design, and can be integrated in subsequent manufacture or construction of buildings, bridges, dams, ships, aircraft and automobiles, for example, and in bioengineering applications.
REFERENCES:
patent: 4079165 (1978-03-01), Morley
patent: 4979992 (1990-12-01), Bache
patent: 5408882 (1995-04-01), McKinley et al.
patent: 5417103 (1995-05-01), Hunter et al.
patent: 5438402 (1995-08-01), Gupta
patent: 5440674 (1995-08-01), Park
patent: 5524636 (1996-06-01), Sarvazyan et al.
patent: 5737277 (1998-04-01), Priest
patent: 5774124 (1998-06-01), Itoh et al.
patent: 5796617 (1998-08-01), Ville
Nguyen Cuong H.
The Trustees of Columbia University in the City of New York
Trammell James P.
LandOfFree
Stress analysis using a defect-free four-node finite element tec does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stress analysis using a defect-free four-node finite element tec, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stress analysis using a defect-free four-node finite element tec will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1159241