Strengthening inter-tile adhesion

Static structures (e.g. – buildings) – Processes – Assembling exposed modules

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Details

52590, 156 71, 404 40, E04B 500

Patent

active

040953882

ABSTRACT:
Changes in temperature and humidity over a long period of time lead to propensities for breaking the adhesive bond between adjacent tiles when the tiles are adhered together only at underfitting-overhanding boundary zones. Propensities for such malfunctioning are minimized by providing two sizes of tiles and laying the rectangular tiles so that in both rectangular directions, the adhesive paths across the floor area are not straight lines, but have offsets and staggers so that there is no straight line of adhesion longer than the length of one and one-half large tiles.

REFERENCES:
patent: 3988187 (1976-10-01), Breault

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