Strained SOI MOSFET device and method of fabricating same

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Field effect transistor

Reexamination Certificate

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C257S190000, C257S194000, C257S195000, C257S347000, C257S350000, C257S371000, C257S616000, C438S172000, C438S199000, C438S275000, C438S279000, C438S528000

Reexamination Certificate

active

06849883

ABSTRACT:
A MOSFET device including a semiconductor substrate, an SiGe layer provided on top of the semiconductor substrate, an Si layer provided on top of the SiGe layer; and a first isolation region for separating the Si layer into a first region and a second region, wherein the Si layer in the second region is turned into an Si epitaxial layer greater in thickness than the Si layer in the first region. The MOSFET device further includes at least one first MOSFET with the Si layer in the first region serving as a strained Si channel, and at least one second MOSFET with the Si epitaxial layer serving as an Si channel.

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Kern Rim et al., “Fabricating and Analysis of Deep Submicron Strained-Si N-MOSFET's”, IEEE Transactions on Electron Devices, vol. 47, No. 7, Jul. 2000, pp. 1406-1415.
T. Mizuno et al., “Electron and Hole Mobility Enhancement in Strained-Si MOSFET's on SiGe-on-Insulator Substrates Fabricated by SIMOX Technology”, IEEE Electron Device Letters, vol. 21, No. 5 May 2000, pp. 230-232.

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