Strained-silicon device with different silicon thicknesses

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Non-single crystal – or recrystallized – material containing...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S369000

Reexamination Certificate

active

07417250

ABSTRACT:
A method of manufacturing a semiconductor device includes providing a strained-silicon semiconductor layer over a silicon germanium layer, and partially removing a first portion of the strained-silicon layer. The strained-silicon layer includes the first portion and a second portion, and a thickness of the second portion is greater than a thickness of the first portion. Initially, the first and second portions of the strained-silicon layer initially can have the same thickness. A p-channel transistor is formed over the first portion, and a n-channel transistor is formed over the second portion. A semiconductor device is also disclosed.

REFERENCES:
patent: 6339232 (2002-01-01), Takagi
patent: 6600170 (2003-07-01), Xiang
patent: 6764908 (2004-07-01), Kadosh et al.
patent: 2002/0030227 (2002-03-01), Bulsara et al.
patent: 2003/0013287 (2003-01-01), Lochtefeld et al.
patent: 2003/0062586 (2003-04-01), Wallace et al.
patent: 2003/0077867 (2003-04-01), Fitzgerald
patent: 2003/0227013 (2003-12-01), Currie et al.
patent: 2004/0171223 (2004-09-01), Hammond et al.
patent: 2004/0175872 (2004-09-01), Yeo et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Strained-silicon device with different silicon thicknesses does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Strained-silicon device with different silicon thicknesses, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Strained-silicon device with different silicon thicknesses will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4012734

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.