Strain relief technique for surface acoustic wave devices

Wave transmission lines and networks – Coupling networks – Delay lines including elastic surface wave propagation means

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333194, H03H 910, H03H 964, H03H 942

Patent

active

044220553

ABSTRACT:
A strain isolation technique for a surface acoustic wave (SAW) device having a piezoelectric SAW substrate is disclosed. A cut in the surface of the piezoelectric SAW substrate forms an isolated surface region where active SAW signal propagation occurs. The cut prevents undesirable surface strains from affecting SAW signal propagation in the isolated region.

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patent: 3810257 (1974-05-01), Jones et al.
patent: 4004254 (1977-01-01), De Vries
patent: 4085620 (1978-04-01), Tanaka
patent: 4100811 (1978-07-01), Cullen et al.
patent: 4213104 (1980-07-01), Cullen et al.

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