Strain-engineered direct-gap Ge/SnxGe1-x heterodiode and...

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

Reexamination Certificate

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C257S014000, C257S015000, C257S021000

Reexamination Certificate

active

06897471

ABSTRACT:
This invention teaches two new families of Si-based Ge/SnxGe1-xheterodiode and multiple quantum well (MQW) photonic devices: (1) band-to-band photodetectors, lasers, emitters, amplifiers and modulators for the 1.5 to 12 μm wavelength range; (2) intersubband photodetectors, lasers, emitters and modulators for 12 to 100 μm operation. The bipolar band-to-band devices have applications within the 1.5-2.2, 3-5 and 8-to-12 μm bands. The unipolar intersubband group has longwave infrared and terahertz applications. All strained-layer devices are grown a relaxed SnySizGe1-y-zbuffer layer—a virtual substrate (VS) grown directly upon a silicon wafer by unique LT UHV-CVD. The VS provides a low-defect atomic template for subsequent heteroepitaxy and is an essential enabling technique for engineering tensile and compressive strain within the Ge/SnxGe1-xMQW by selecting the VS lattice parameter to be approx midway between the layer lattices.

REFERENCES:
patent: 4769341 (1988-09-01), Luryi
patent: 5523592 (1996-06-01), Nakagawa et al.
patent: 5548128 (1996-08-01), Soref et al.
patent: 6151347 (2000-11-01), Noel et al.

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