Storage life of Pb-In-Ag solder foil by Sn addition

Details Storage life of Pb-In-Ag solder foil by Sn addition Storage life of Pb-In-Ag solder foil by Sn addition

1985-11-27

1987-03-31

Rutledge, L. Dewayne

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

75251, 420563, 420566, 420570, C22C 1106

Patent

active

046542752

ABSTRACT:
A lead based, tin free alloy is modified by adding thereto about 0.5 to 4 weight percent of tin. The alloy is rapidly solidified by forming a melt thereof containing the tin addition and quenching the melt on a moving chill surface at a quenching rate of at least about 10.sup.5 .degree. C./sec. Addition of the tin inhibits formation of lead oxide film in the rapidly solidified alloy and substantially increases the storage life thereof.

REFERENCES:
patent: 3414969 (1968-12-01), Blum et al.
patent: 3644115 (1972-02-01), Hamaguchi et al.
patent: 4070192 (1978-01-01), Arbib et al.
patent: 4209570 (1980-06-01), DeCristofaro et al.
patent: 4512950 (1985-04-01), Hosoda et al.
patent: 4517027 (1985-05-01), Bickerdike et al.
"Solder for Low Temperature Soldering", Batrakov et al., Chemical Abstracts, vol. 82, article 47041x, p. 250.
"METGLAS Brazing Foil", DeCristofaro et al., Welding Journal, Jul. 1978, pp. 33-38.

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