Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1997-09-09
2000-09-12
Donovan, Lincoln
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
H01R 909
Patent
active
061169153
ABSTRACT:
An information handling system includes stacks of printed circuit boards interconnected using an interconnection system. The printed circuit boards include network boards, system interface boards, memory boards, and central processing unit boards. The interconnection system for electrically connecting the various printed circuit boards includes a set of interconnection modules placed adjacent one another to form a substantially aligned row. The interconnection modules can be used to connect one stack to an orthogonally oriented stack or to a parallel oriented stack. The printed circuit board used in the interconnection system includes an inner rail positioned near the edge of the printed circuit board, an outer rail positioned near the edge of the printed circuit board, and an alignment stop attached to or positioned near one of the inner or outer rail. The most distant interconnection module of a row of aligned modules includes a spring attached thereto. The spring biases the set of interconnection modules toward the alignment stop to lessen the amount of stack up tolerance or float between the individual modules in the aligned row of interconnection modules. Electrical contact points located between the inner and the outer rail. The modules include alignment feet which have corresponding contact points. The inner and outer rail includes slots therein for clearance of the interconnection modules with the contact points.
REFERENCES:
patent: 5167511 (1992-12-01), Krajewski et al.
McDaniel Kent T.
Smith Bradley J.
Spanier Gregory David
Cray Research Inc.
Donovan Lincoln
Zarroli Michael C.
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