Stiffening support for printed circuit assemblies

Details Stiffening support for printed circuit assemblies Stiffening support for printed circuit assemblies

2011-01-11

2011-01-11

Levi, Dameon E (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S807000, C174S520000

Reexamination Certificate

active

07869220

ABSTRACT:
A packaging assembly includes a printed circuit assembly coupled to a stiffening device, which may take the form of a custom-shaped stiffening member or take the form of a support member having spokes attached to a rim. The printed circuit assembly includes a printed circuit board with a number of electrical components extending from a surface of the board. The stiffening member or the support member includes openings that receive the electrical components while providing additional stiffness to the board.

REFERENCES:
patent: 3918052 (1975-11-01), Bricher
patent: 6166553 (2000-12-01), Sinsheimer
patent: 6362978 (2002-03-01), Boe
patent: 6420885 (2002-07-01), Fredrickson
patent: 6462955 (2002-10-01), Roberts
patent: 6512678 (2003-01-01), Sims et al.
patent: 6771517 (2004-08-01), Crapisi et al.
patent: 6777629 (2004-08-01), Lane et al.
patent: 6836020 (2004-12-01), Cheng et al.
patent: 6853205 (2005-02-01), Cheng et al.
patent: 6894523 (2005-05-01), Neeb
patent: 6943292 (2005-09-01), Dingman
patent: 7092539 (2006-08-01), Sheplak et al.
patent: 7382946 (2008-06-01), Oggioni et al.
patent: 7471078 (2008-12-01), Hobbs et al.
patent: 2002/0149070 (2002-10-01), Sheplak et al.
patent: 2003/0034239 (2003-02-01), Chason et al.
patent: 2004/0141421 (2004-07-01), Cheng et al.
patent: 2005/0162389 (2005-07-01), Obermeyer et al.
patent: 2006/0093259 (2006-05-01), Oggioni et al.
patent: 2008/0069494 (2008-03-01), Oggioni et al.

Affiliated with

Also associated with

Rating

Stiffening support for printed circuit assemblies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stiffening support for printed circuit assemblies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stiffening support for printed circuit assemblies will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2727026