Stiffener with integrated heat sink attachment

Details Stiffener with integrated heat sink attachment Stiffener with integrated heat sink attachment

1997-05-02

1999-08-17

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361702, 361707, 361709, 165 802, 165 803, 165185, 257706, 257717, 257718, 257719, 257721, 257722, 257787, H05K 720

Patent

active

059402717

ABSTRACT:
An electronic semiconductor device package, the package comprising: a substrate having traces; a die attached to the substrate; first level interconnects of the die to the traces of the substrate; and a stiffener attached to the substrate, wherein the stiffener comprises at least one clip. A system for attaching a heat sink to an electronic semiconductor device package, the system comprising: a stiffener of the electronic package which is attachable to the electronic package; and at least one clip that is integral with the stiffener and secures the heat sink to the stiffener. A method of detachably attaching a heat sink to an electronic semiconductor device package, the method comprising: attaching a stiffener to the package, wherein the stiffener comprises at least one clip; positioning a heat sink adjacent the stiffener; and engaging the clip with the heat sink, wherein the heat sink is secured to the stiffener by the clip.

REFERENCES:
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 5003429 (1991-03-01), Baker et al.
patent: 5621615 (1997-04-01), Dawson et al.

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