Sticking apparatus and sticking method

Details Sticking apparatus and sticking method Sticking apparatus and sticking method

2005-04-27

2009-11-03

Tucker, Philip C (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S267000, C156S308200, C156S345420, C156S510000, C156S537000, C156S583100, C156S583200

Reexamination Certificate

active

07611600

ABSTRACT:
A sticking apparatus10includes a sticking table11supporting a semiconductor wafer W and a sticking unit12sticking a heat sensitive adhesive sheet S to the semiconductor wafer W. The sticking unit12includes a peeling section that, when paying out a raw sheet L having adhesive sheet S laminated to one side face of a release liner PS, peels off the release liner PS and the adhesive sheet S and a sheet preliminary peeling unit40provided at an upstream side of the peeling section in a pay-out direction of the raw sheet. The sheet preliminary peeling unit40includes a moving member50that moves to and from in a state of being pinched between the release liner PS and the adhesive sheet S. The preliminarily peeled-off release liner PS and adhesive sheet S are temporarily re-bonded by a temporary re-bonding unit41,enabling to stick the adhesive sheet S on the wafer W.

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