Sticking and cutoff device for adhering adhesive tape on thin ar

Details Sticking and cutoff device for adhering adhesive tape on thin ar Sticking and cutoff device for adhering adhesive tape on thin ar

1987-10-07

1989-09-12

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

156248, 156360, 156522, 83368, B26D 500, B32B 3100, G05G 1500

Patent

active

048656771

ABSTRACT:
A device for sticking adhesive tape to thin articles, such as semiconductor wafers, and trimming excess portions of said tape from the thin articles. A plurality of sticking rollers apply adhesive tape from a roll to each thin article, the tape having an adhesive side oriented towards an upper surface of the article and a width greater than a width of the article. A suction stage receives and holds each of the thin articles with the adhesive tape stuck thereto by said sticking rollers while a tape cutter trims the excess portion of the tape from along peripheral edge portions of the article. A tape peeling device then peels off the trimmed excess portions of the tape from the thin article, whereupon the thin article is conveyed back to a cassette.

REFERENCES:
patent: 4510009 (1985-04-01), Takagi
patent: 4680079 (1987-07-01), Tanaka
patent: 4696712 (1987-09-01), Nouaka

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