Stereolithographic method for fabricating heat sinks,...

Details Stereolithographic method for fabricating heat sinks,... Stereolithographic method for fabricating heat sinks,...

2006-04-11

2006-04-11

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S121000, C438S123000, C438S125000

Reexamination Certificate

active

07026191

ABSTRACT:
A stereolithographically fabricated heat sink includes a heat transfer element cofigured to be disposed proximate a semiconductor device so as to absorb heat from the semiconductor device during use thereof. The heat sink also has a heat dissipation element that is configured to release heat as air flows past a surface thereof. When stereolithographic processes are used to fabricate the heat dissipation element of the heat sink, the heat dissipation element can have non-linear, or convoluted passageways formed therethrough, through which air can flow. As at least a portion of the heat sink is stereolithographically fabricated, that portion can have a series of superimposed, contiguous, mutually adhered layers of thermally conductive material. The layers can be fabricated by consolidated selected regions of a layer of unconsolidated particulate or powdered material, or by defining an object layer from a sheet of material. The stereolithographic method may include use of a machine vision system including at least one camera operably associated with a computer controlling a stereolithographic application of material so that the system may recognize the position and orientation of a semiconductor device or other substrate on which the heat sink is to be fabricated.

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