Stereolithographic method and apparatus for packaging...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C264S272110, C438S106000

Reexamination Certificate

active

06909929

ABSTRACT:
A stereolithographic method and apparatus for applying packaging material to workpieces, such as preformed electronic components, including semiconductor dice, with a high degree of precision, and resulting articles. A machine vision system including at least one camera is operably associated with a computer controlling a stereolithographic system for application of material so that the system may recognize the position and orientation of workpieces, such as semiconductor dice, to which the material is to be applied. The requirement for precise mechanical workpiece alignment is eliminated, and the ability of the system to recognize size, configuration and topography of different workpieces affords greater manufacturing flexibility. The method includes stereolithographic application of material for packaging electronic components, and the electronic components so packaged are also part of the invention.

REFERENCES:
patent: 4577056 (1986-03-01), Butt
patent: 4696525 (1987-09-01), Coller et al.
patent: 5028983 (1991-07-01), Bickford et al.
patent: 5173220 (1992-12-01), Reiff et al.
patent: 5264061 (1993-11-01), Juskey et al.
patent: 5278442 (1994-01-01), Prinz et al.
patent: 5433260 (1995-07-01), Taylor
patent: 5484314 (1996-01-01), Farnworth
patent: 5641996 (1997-06-01), Omoya et al.
patent: 5675122 (1997-10-01), Taylor
patent: 5705117 (1998-01-01), O'Connor et al.
patent: 5754408 (1998-05-01), Derouiche
patent: 5801073 (1998-09-01), Robbins et al.
patent: 5834840 (1998-11-01), Robbins et al.
patent: 5953594 (1999-09-01), Bhatt
patent: 6048744 (2000-04-01), Corisis et al.
patent: 6073056 (2000-06-01), Gawronski et al.
patent: 6251488 (2001-06-01), Miller et al.
patent: 6259962 (2001-07-01), Gothait
patent: 6268584 (2001-07-01), Keicher et al.
patent: 6299057 (2001-10-01), Ball
patent: 6326698 (2001-12-01), Akram
patent: 6337122 (2002-01-01), Grigg et al.
patent: 6391251 (2002-05-01), Keicher et al.
patent: 6432752 (2002-08-01), Farnworth
patent: 6482576 (2002-11-01), Farnworth et al.
patent: 6489007 (2002-12-01), Grigg et al.
patent: 6514798 (2003-02-01), Farnworth
patent: 6524346 (2003-02-01), Farnworth
patent: 6544465 (2003-04-01), Farnworth et al.
patent: 6544821 (2003-04-01), Akram
patent: 6544902 (2003-04-01), Farnworth
patent: 6562278 (2003-05-01), Farnworth et al.
patent: 6585927 (2003-07-01), Grigg et al.
patent: 6593171 (2003-07-01), Farnworth
patent: 6607689 (2003-08-01), Farnworth
patent: 6635333 (2003-10-01), Grigg et al.
patent: 2002/0066966 (2002-06-01), Farnworth
patent: 2002/0098623 (2002-07-01), Akram
patent: 2002/0171177 (2002-11-01), Kritchman et al.
patent: 2002/0182782 (2002-12-01), Farnworth
patent: 2002/0195748 (2002-12-01), Farnworth
patent: 2003/0003179 (2003-01-01), Farnworth et al.
patent: 2003/0003180 (2003-01-01), Farnworth et al.
patent: 2003/0003380 (2003-01-01), Farnworth et al.
patent: 2003/0003405 (2003-01-01), Farnworth et al.
patent: 2003/0043360 (2003-03-01), Farnworth
patent: 2003/0068584 (2003-04-01), Farnworth et al.
patent: 2003/0072926 (2003-04-01), Grigg et al.
patent: 2003/0077418 (2003-04-01), Grigg et al.
patent: 2003/0089999 (2003-05-01), Akram
patent: 2003/0092220 (2003-05-01), Akram
patent: 2003/0102566 (2003-06-01), Farnworth
patent: 2003/0129787 (2003-07-01), Farnworth
patent: 2003/0151167 (2003-08-01), Kritchman et al.
patent: 2003/0155693 (2003-08-01), Farnworth et al.
patent: 2003/0201531 (2003-10-01), Farnworth et al.
patent: 2003/0203158 (2003-10-01), Farnworth et al.
patent: 2003/0205849 (2003-11-01), Farnworth
patent: 2003/0207213 (2003-11-01), Farnworth
Miller et al., “Maskless Mesoscale Materials Deposition”, Deposition Technology, Sep. 2001, pp. 20-22.
Miller, “New Laser-Directed Deposition Technology”, Microelectronic Fabrication, Aug. 2001, p. 16.
Webpage, Objet Prototyping the Future, Objet FullCure700 Series, 1 page.
Webpage, Objet Prototyping the Future, How it Works, 2 pages.
U.S. Appl. No. 09/589,841, filed Jun. 8, 2000, entitled “Stereolithographic Methods for Forming a Protective Layer on a Semiconductor Device Substrate and Substrates Including Protective Layers So Formed”, inventor Farnworth et al.
U.S. Appl. No. 09/651,930, filed Aug. 31, 2000, entitled “Semiconductor Device Including Leads in Communication with Contact Pads Thereof and a Stereolithographically Fabricated Package Substantially Encapsulating the Leads and Methods for Fabricating the Same”, inventor Salman Akram.
U.S. Appl. No. 10/370,755, filed Feb. 20, 2003, entitled “Chip Scale Package Structures and Method of Forming Conductive Bumps Thereon”, inventor Warren M. Farnworth.
U.S. Appl. No. 10/608,749, filed Jun. 26, 2003, entitled “Methods for Labeling Semiconductor Device Components”, inventor Grigg et al.
U.S. Appl. No. 10/619,918, filed Jul. 15, 2003, entitled “Stereolithographic Methods for Fabricating Hermetic Semiconductor Device Packages and Semiconductor Devices Including Stereolithographically Fabricated Hermetic Packages”, inventor Warren M. Farnworth.
U.S. Appl. No. 10/663,402, filed Sep. 16, 2003, entitled “Processes for Facilitating Removal of Stereolithographically Fabricated Objects From Platens of Stereolithographic Fabrication Equipment, Object Release Elements For Effecting Such Processes, Systems and Fabrication Processes Employing the Object Release Elements, and Objects Which Have Been Fabricated Using the Object Release Elements”, inventor Farnworth et al.
U.S. Appl. No. 10/672,098, filed Sep. 26, 2003, entitled “Apparatus and Methods for Use in Stereolithographic Processing of Components and Assemblies”, inventor Warren M. Farnworth.
U.S. Appl. No. 10/690,417, filed Oct. 20, 2003, entitled “Methods of Coating and Singulating Wafers and Chip-Scale Packages Formed Therefrom”, inventor Farnworth et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Stereolithographic method and apparatus for packaging... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stereolithographic method and apparatus for packaging..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stereolithographic method and apparatus for packaging... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3490893

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.