Stepper process for VLSI circuit manufacture utilizing radiation

Details Stepper process for VLSI circuit manufacture utilizing radiation Stepper process for VLSI circuit manufacture utilizing radiation

1985-11-01

1987-06-30

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Registration or layout process other than color proofing

430 5, 430311, 430339, G03F 900, G03C 1100

Patent

active

046770437

ABSTRACT:
The step-on-wafer process, also known as the step-and-repeat alignment process, for the production of very large scale integration (VLSI) microcircuitry with multi-layer interconnects, is greatly facilitated by incorporating, into at least the first layer of photoresist, a dyestuff which meets certain criteria the chief of which is that it be transparent to radiation to which the photoresist system is sensitive and that it absorb radiation of a wavelength to which the photoresist system is not sensitive. The use of photoresist systems in association with such dyestuffs has additional advantages. For example, the thickness of the photoresist layer deposited on a substrate can be checked prior to imaging without activating the photoresist.

REFERENCES:
patent: 3355294 (1967-11-01), Giddings
patent: 4251622 (1981-02-01), Kimoto et al.
patent: 4332872 (1982-06-01), Zingher
patent: 4345011 (1982-08-01), Drexhage
patent: 4374915 (1983-02-01), Ahlquist et al.
patent: 4621042 (1986-11-01), Pampalone et al.
Kosar, J., "Light-Sensitive Systems", J. Wiley & Sons, 1965, pp. 387-397.
Douglas, E. C., Solid State Technology, pp. 65-72, 5/1981.
Loebach, E. W., "Wafer Printing with Step-and-Repeat Aligners", IGC Conference, Carmel, Calif., 6/30-7/2/1980.

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