Stepped multilayer interconnection apparatus and method of makin

Details Stepped multilayer interconnection apparatus and method of makin Stepped multilayer interconnection apparatus and method of makin

1991-07-30

1992-11-24

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428195, 428688, 174250, 361397, 361414, B32B 900

Patent

active

051659840

ABSTRACT:
A stepped multilayer Printed Wiring Board (PWB) (10), having an increased number of wiring paths in selected regions, is comprised of a main multilayer PWB (12) having a sufficient number of layers (12.sub.1,12.sub.2,12.sub.3 . . . 12.sub.n) to provide the lowest number of wiring paths required anywhere on the board. In regions where a larger number of wiring paths are required, a secondary, multilayer PWB section (22), having a sufficient number of layers (22.sub.1,22.sub.2,22.sub.3) to provide the required additional number of wiring paths, is connected to the main PWB by a layer of anisotropically conductive material (30) sandwiched therebetween. A plurality of mechanical fasteners (33,33'), typically bifurcated or heat-staked plastic pins, extends through the secondary PWB section and the main PWB to hold one to the other.

REFERENCES:
patent: 3142610 (1964-07-01), Lowe
patent: 4880684 (1989-11-01), Boss et al.

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