Step-down transition of a solder head in the injection...

Details Step-down transition of a solder head in the injection... Step-down transition of a solder head in the injection...

2011-08-23

2011-08-23

Ward, Jessica L (Department: 1735)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

C228S043000, C228S256000

Reexamination Certificate

active

08002164

ABSTRACT:
A mold plate to parking location interface includes: a mold plate for holding solder; a fill head with an o-ring for dispensing solder bumps on the mold plate; a parking location for locating the fill head; and a platform between the mold plate and the parking location for relatively moving the fill head from the first location to the second location such that the o-ring decompresses as it passes over the platform.

REFERENCES:
patent: 6231333 (2001-05-01), Gruber et al.
patent: 6814918 (2004-11-01), Pedigo
patent: 7607527 (2009-10-01), Yazaki et al.
patent: 2006/0191590 (2006-08-01), Wegman
patent: 2007/0263026 (2007-11-01), Shang et al.
patent: WO 2005070792 (2005-08-01), None

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