Step cavity for enhanced drop test performance in ball grid...

Details Step cavity for enhanced drop test performance in ball grid... Step cavity for enhanced drop test performance in ball grid...

2011-06-07

2011-06-07

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S730000

Reexamination Certificate

active

07956475

ABSTRACT:
A ball grid array (BGA) package includes a substrate layer having first and second sides. A semiconductor chip is attached to the first side of the substrate layer by a dielectric adhesive layer. A plurality of solder balls are attached to the second side of the substrate layer. The solder balls may be set out by rows and columns. A plurality of wires electrically connect the semiconductor chip to the solder balls. A layer of encapsulating compound is deposited over the semiconductor chip. A step cavity of a selected depth and shape is formed in the layer of encapsulating compound at or near the edge or periphery of the layer of encapsulating compound. The step cavity is separated from the solder balls by the substrate layer but spans over a plurality of selected solder balls.

REFERENCES:
patent: 5708300 (1998-01-01), Woosley et al.
patent: 6664647 (2003-12-01), Kasuga et al.
patent: 6841424 (2005-01-01), Bolken
patent: 6873060 (2005-03-01), Blaszczak et al.
patent: 7095097 (2006-08-01), Tandy et al.

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