Stencil stamp unit

Details Stencil stamp unit Stencil stamp unit

1996-10-04

1998-07-14

Bennett, Christopher A.

Printing

Stenciling

Stencil and pad inker

101333, B41L 2726

Patent

active

057787760

ABSTRACT:
A stamp device including a stamp body including a grip portion at an upper end thereof and a base portion at a lower end thereof; an ink impregnated body impregnated with ink and attached to the base portion of the stamp body; a thermal stencil sheet disposed on the stamp body so as to cover the ink impregnated body; a skirt member fitted around the lower end of the stamp body; and a mechanism for maintaining intimate contact between the thermal stencil sheet and the stamp body.

REFERENCES:
patent: 2020151 (1935-11-01), Madden
patent: 3832947 (1974-09-01), Funahashi
patent: 4441422 (1984-04-01), Dreeben
patent: 4996921 (1991-03-01), Hong
patent: 5115729 (1992-05-01), Beckman et al.
patent: 5377599 (1995-01-01), Wall et al.

Affiliated with

Also associated with

Rating

Stencil stamp unit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stencil stamp unit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stencil stamp unit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1872209