Stencil perforating method, stencil perforating system, and sten

Details Stencil perforating method, stencil perforating system, and sten Stencil perforating method, stencil perforating system, and sten

1994-08-16

1996-09-24

Tran, Huan H.

Incremental printing of symbolic information

Thermal marking apparatus or processes

Specific resistance recording element type

347171, B41J 2335

Patent

active

055595464

ABSTRACT:
A heat sensitive stencil is brought into contact with a thermal head having a plurality of heating resistors arranged in a row, is moved in a sub-scanning direction orthogonal to a direction in which the heating resistors are arranged, and is perforated in the dot matrix shape with selectively heated heating resistors. The heat sensitive stencil is made substantially only of a thermoplastic resin film. A width of a non-perforated portion of the heat sensitive stencil between two adjacent perforations is 20% or more of a pitch between two adjacent heating resistors in the main scanning direction.

REFERENCES:
patent: 5140898 (1992-08-01), Igarashi
patent: 5224419 (1993-07-01), Fukai
patent: 5355793 (1994-10-01), Sato et al.
patent: 5384585 (1995-01-01), Okumura

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