Stencil and apparatus for supporting and tensioning the stencil

Printing – Stenciling – Stencils

Reexamination Certificate

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Details

C038S102300

Reexamination Certificate

active

07000538

ABSTRACT:
A support and tensioning frame for a stencil to enable solder paste to be applied to printed circuit boards and other electronic substrates includes a support frame engaged with at least two opposed mounting members. Each mounting member includes at least one projection for engaging an aperture in a stencil to mount the stencil under tension. A permanent-biasing mechanism engages one or more of the mounting members to place the stencil under tension. A second biasing mechanism engages the mounting member to provide a bias opposite that of the permanent-biasing mechanism to facilitate release of a mounted stencil.

REFERENCES:
patent: 2073379 (1937-03-01), Rasmussen
patent: 2563972 (1951-08-01), Steen et al.
patent: 3303777 (1967-02-01), Feier et al.
patent: 3416445 (1968-12-01), Krueger, Jr.
patent: 3608484 (1971-09-01), Bubbley et al.
patent: 4442772 (1984-04-01), Bubbley
patent: 5170058 (1992-12-01), Berasi et al.
patent: 5220867 (1993-06-01), Carpenter
patent: 5979312 (1999-11-01), Williams
patent: 5983790 (1999-11-01), Switzer et al.
patent: 6067903 (2000-05-01), Williams
patent: 6289804 (2001-09-01), Williams
patent: 744901 (1933-04-01), None
patent: 2264460 (1993-09-01), None

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