Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2006-01-04
2009-02-10
Andújar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S082000, C257SE33077
Reexamination Certificate
active
07489042
ABSTRACT:
A stem for an optical element includes a base-like portion located on a portion of a package side surface of an eyelet, higher than the package side surface. A block is located on a surface of the base-like portion of the eyelet. An optical element mounting surface of the block projects outward, overhanging a side face of the base-like portion, close to lead electrodes which are inserted through holes of the eyelet, respectively, and sealed with sealing glass. High-frequency line substrates are located on the optical element mounting surface of the block, and Au films of the high-frequency line substrate are electrically connected to respective lead electrodes.
REFERENCES:
patent: 5557074 (1996-09-01), Miyamoto et al.
patent: 7109523 (2006-09-01), Ishimura
patent: 2004/0060727 (2004-04-01), Kojima et al.
patent: 2005/0121684 (2005-06-01), Aruga et al.
patent: 06-029451 (1994-02-01), None
patent: 08-125259 (1996-05-01), None
patent: 2004-047830 (2004-02-01), None
patent: 2004-127963 (2004-04-01), None
Oshima Isao
Takagi Shin-ichi
Andújar Leonardo
Leydig , Voit & Mayer, Ltd.
Mitsubishi Denki & Kabushiki Kaisha
Soderholm Krista
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