Steam cleaning system and method for semiconductor process...

Details Steam cleaning system and method for semiconductor process... Steam cleaning system and method for semiconductor process...

2005-08-30

2005-08-30

Carrillo, Sharidan (Department: 1746)

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

C134S022100, C134S022110, C134S022120, C134S022150, C134S022180, C134S031000, C134S036000, C134S034000, C134S037000, C134S102100

Reexamination Certificate

active

06936114

ABSTRACT:
Disclosed are systems and methods for removing stubborn contaminants, aluminum fluoride and aluminum chloride in particular, from components of semiconductor-processing equipment. One embodiment forces steam through small holes in a gas distribution plate to remove build up on the interior walls of the holes. A cleaning fixture disposed between the steam source and the gas distribution plate delivers the steam at increased pressures. The gas distribution plate can be immersed in water during cleaning to capture the exiting steam.

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CRC Handbook of Chemistry and Physics, A Ready-Reference Book of Chemical and Physical Data, cover sheet, 8-102 and 8-103. 1999-2000, 80thedition. CRC Press (Boca Raton, London, New York, and Washington D.C.).

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