Standoffs for centralizing internals in packaging process

Details Standoffs for centralizing internals in packaging process Standoffs for centralizing internals in packaging process

2004-03-12

2008-12-09

Ha, Nathan W (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

Reexamination Certificate

active

07462510

ABSTRACT:
A semiconductor device, semiconductor die package, mold tooling, and methods of fabricating the device and packages are provided. In one embodiment, the semiconductor device comprises a pair of semiconductor dies mounted on opposing sides of a flexible tape substrate, the outer surfaces of the dies having one or more standoffs disposed thereon. The standoffs can be brought into contact with an inner surface of the mold plates of a mold tooling when the device is positioned between the mold plates to maintain the flexible tape substrate in a centralized position within a mold chamber and inhibit the tape from bending as a molding compound flows into the chamber during encapsulation.

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