Stand-off structure for flipped chip butting

Details Stand-off structure for flipped chip butting Stand-off structure for flipped chip butting

1989-11-22

1991-09-03

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29467, 29832, 156241, 156281, 156297, 1563043, 437209, B32B 3100

Patent

active

050451421

ABSTRACT:
A pagewidth array is fabricated to include a plurality of heating element subunits of the same or differing thicknesses, each subunit having a circuit surface and an opposite base surface. The plurality of subunits is inverted with each of the circuit surfaces facing toward a support surface to expose the base surfaces of each subunit. Each of said subunits is butted against an adjacent subunit to form an end-to-end array of butted subunits, and a conformal adhesive is applied to a bonding substrate which is then applied to the base surfaces of the array of butted substrates to form a coplanar adhesive layer across each of said subunits. The circuit surfaces are protected from damage due to contact with said support surface by applying a stand-off layer of substantially uniform thickness to at least a portion of the circuit surfaces prior to inverting the plurality of subunits. The stand-off layer preferably is polyimide.

REFERENCES:
patent: 4184043 (1980-01-01), Hildering
patent: 4466181 (1984-08-01), Takishima
patent: 4622574 (1986-11-01), Garcia
patent: 4690391 (1987-09-01), Stoffel et al.
patent: 4723197 (1988-02-01), Takiar et al.
Miller, IBM Technical Disclosure Bulletin, "Microelectronic Device Standoffs", vol. 8, No. 3, Aug. 1965, p. 380.

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