Stamping machine for mounting retention frame of heat sink...

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Reexamination Certificate

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Details

C029S709000, C029S739000

Reexamination Certificate

active

10879580

ABSTRACT:
A stamping machine for mounting a retention frame of heat sink (510) to a motherboard (500) includes a machine body (100), an adjusting device (200), and a controlling unit (300). The machine body comprises a support plane (110) and a stamping arm (120) extending upwardly from the support plane. A plurality of adjusting positioning blocks (112) is provided on the support plane for fittingly positioning the motherboard. A stamping assembly (130) is positioned at a forepart of the stamping arm comprises a cylinder (140), a stamping block (150) moveably connected to the cylinder, and a base portion (114) attached on the support plane corresponding to the stamping block. A plurality of stamping posts (170) extends from the stamping block and a plurality of retractable pressing pins (180) depends from the stamping block. A resilient member (190) is disposed around each of the pressing pins.

REFERENCES:
patent: 1660720 (1928-02-01), Osborne
patent: 2488205 (1949-11-01), Kopczyniski
patent: 2652732 (1953-09-01), Frye
patent: 2850035 (1958-09-01), Brown
patent: 3086418 (1963-04-01), Levine
patent: 3371254 (1968-02-01), Hagfors
patent: 3496818 (1970-02-01), Porter et al.
patent: 4462291 (1984-07-01), Schulz
patent: 6631556 (2003-10-01), Lee

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