Stamping foils and methods

Details Stamping foils and methods Stamping foils and methods

1982-03-29

1985-01-22

Herbert, Thomas J.

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

Dissimilar adhesives

156230, 156233, 427 96, 428 42, 428215, 428323, 428332, 428346, 428347, 428457, 428901, 428913, 428914, B32B 710, C09J 702

Patent

active

044952325

ABSTRACT:
A stamping foil for forming printed circuit patterns on insulating or poorly conductive substrates comprising an electrically conductive layer made of a highly conductive metal, such as copper, which is endowed with a sufficiently low shear strength, even in thicknesses of 10 microns or more, to permit easy and sharp separation of the activated (imprinted) and non-activated portions of the foil. Such a low shear strength may be achieved with fibrous or fibrous-granular crystallite structures, wherein the fibers are oriented approximately at right angles to the surfaces of the foil, and, in addition, by doping agents containing carbon, nitrogen and sulfur. The foil may comprise a bonding layer for bonding the conductive layer to a substrate, or such a bonding layer may be applied to the surface of the conductive layer before the stamping operation. The conductive layer may be either self-supporting, or it may adhere to a carrier tape through an intermediary separating layer. In the latter case, the bonding and separating layers become activated when compressed by a stamping die or stereotype, whereby the conductive layer becomes bonded to the substrate and separated from the carrier tape in the activated areas. The activated and non-activated portions of the foil are then separable by pulling the carrier tape away from the substrate.

REFERENCES:
patent: 3753850 (1973-08-01), Brunet
patent: 4012552 (1977-03-01), Watts

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